XC2723X Datasheet, PDF (105/109 Pages) Infineon Technologies AG – 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

XC2723X
XC2000 Family / Econo Line
Package and Reliability
5
Package and Reliability
The XC2000 Family devices use the package type:
• PG-VQFN (Plastic Green - Very Thin Profile Quad Flat Non-Leaded Package)
The following specifications must be regarded to ensure proper integration of the
XC2723X in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 40 Package Parameters (PG-VQFN-48-54)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension Ex × Ey –
5.2 x 5.2 mm –
Power Dissipation
Thermal resistance
Junction-Ambient
P_DISS
–
R_ΘJA
–
0.7
W–
73
K/W No thermal via,
2-layer¹⁾
49
K/W No thermal via,
4-layer²⁾
43
K/W 4-layer, no pad³⁾
34
K/W 4-layer, pad⁴⁾
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) without thermal vias; exposed pad not
soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) without thermal vias; exposed pad not
soldered.
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
4) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC2723X is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
Data Sheet
101
V1.2, 2012-07