HY29LV160 Datasheet, PDF (47/48 Pages) Hynix Semiconductor – 16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory

HY29LV160
ORDERING INFORMATION
Hynix products are available in several speeds, packages and operating temperature ranges. The
ordering part number is formed by combining a number of fields, as indicated below. Refer to the ‘Valid
Combinations’ table, which lists the configurations that are planned to be supported in volume. Please
contact your local Hynix representative or distributor to confirm current availability of specific configura-
tions and to determine if additional configurations have been released.
HY29LV160 X X - X X X
SPECIAL INSTRUCTIONS
TEMPERATURE RANGE
Blank = Commercial ( 0 to +70 °C)
I = Industrial (-40 to +85 °C)
SPEED OPTION
70 = 70 ns
80 = 80 ns
90 = 90 ns
12 = 120 ns
PACKAGE TYPE
T = 48-Pin Thin Small Outline Package (TSOP)
F = 48-Ball Fine-Pitch Ball Grid Array (FBGA), 8 x 9 mm
BOOT BLOCK LOCATION
T = Top Boot Block Option
B = Bottom Boot Block Option
DEVICE NUMBER
HY29LV160 = 16 Megabit (2M x 8/1M x 16) CMOS 3 Volt-Only Sector
Erase Flash Memory
VALID COMBINATIONS
Package and Speed
FBGA
TSOP
Temperature 70 ns 80 ns 90 ns 120 ns 70 ns 80 ns 90 ns 120 ns
Operating Voltage = 2.7 - 3.6 Volts
Commercial
--
F-80
F-90
F-12
--
T-80
T-90
T-12
Industrial
--
F-80I
F-90I
F-12I
--
T-80I
T-90I
T-12I
Operating Voltage = 3.0 - 3.6 Volts
Commercial
F-70
--
--
--
T-70
--
T-90V T-12V
Industrial
F-70I
--
--
--
T-70I
--
--
--
Note:
1. The complete part number is formed by appending the Boot Block Location code and the suffix shown in the table to the
Device Number. For example, the part number for a 90 ns, Industrial temperature range device in the TSOP package
with the top boot block option is HY29LV160TT-90I.
Rev. 1.2/May 01
47