RFM42 Datasheet, PDF (28/110 Pages) –

RFM42/43
5.3. Crystal Oscillator For RF42/RF43 IC
The RF42/43 includes an integrated 30 MHz crystal oscillator with a fast start-up time of less than 600 μs when a
suitable parallel resonant crystal is used. The design is differential with the required crystal load capacitance
integrated on-chip to minimize the number of external components. By default, all that is required off-chip is the
30 MHz crystal blank.
The crystal load capacitance can be digitally programmed to accommodate crystals with various load capacitance
requirements and to slightly adjust the frequency of the crystal oscillator. The tuning of the crystal load capacitance is
programmed through the xlc[6:0] field of "Register 09h. 30 MHz Crystal Oscillator Load Capacitance". The total internal
capacitance is 12.5 pF and is adjustable in approximately 127 steps (97fF/step). The xtalshift bit is a course shift in
frequency but is not binary with xlc[6:0].
The crystal load capacitance can be digitally programmed to accommodate crystals with various load capacitance
requirements and to slightly adjust the frequency of the crystal oscillator. This latter function can be used to
compensate for crystal production tolerances. Utilizing the on-chip temperature sensor and suitable control software
even the temperature dependency of the crystal can be canceled.
The crystal load capacitance is programmed using register 09h. The typical value of the total on-chip (internal)
capacitance Cint can be calculated as follows:
Cint = 1.8 pF + 0.085 pF x xlc[6:0] + 3.7 pF x xtalshift
Note that the course shift bit xtalshift is not binary with xlc[6:0]. The total load capacitance Cload seen by the crystal
can be calculated by adding the sum of all external parasitic PCB capacitances Cext to Cint. If the maximum value
of Cint (16.3 pF) is not sufficient, an external capacitor can be added for exact tuning. See more on this, calculating
Cext and crystal selection guidelines in "10. Application Notes" .
If AFC is disabled then the synthesizer frequency may be further adjusted by programming the Frequency Offset
field fo[9:0]in "Register 73h. Frequency Offset 1" and "Register 74h. Frequency Offset 2", as discussed in "3.6.
Frequency Control".
The crystal oscillator frequency is divided down internally and may be output to the microcontroller through one of
the GPIO pins for use as the System Clock. In this fashion, only one crystal oscillator is required for the entire
system and the BOM cost is reduced. The available clock frequencies (i.e., internal division ratios) and the GPIO
configuration are discussed further in "7.2. Microcontroller Clock".
Function/Descripti
POR
Add R/W
D7
D6
D5
D4
D3
D2
D1
D0
on
Def.
Crystal Oscillator Load
09 R/W
xtalshift xlc[6] xlc[5] xlc[4] xlc[3] xlc[2] xlc[1] xlc[0] 40h
Capacitance
5.4. Regulators
There are a total of six regulators integrated onto the RFM42/43. With the exception of the IF and Digital all
regulators are designed to operate with only internal decoupling. The IF and Digital regulators both require an
external 1 μF decoupling capacitor. All of the regulators are designed to operate with an input supply voltage
from +1.8 to +3.6 V, and produce a nominal regulated output voltage of +1.7 V ±5%. The internal circuitry
nominally operates from this regulated +1.7 V supply. The output stage of the of PA is not connected internally to
a regulator and is connected directly to the battery voltage.
A supply voltage should only be connected to the VDD pins. No voltage should be forced on the IF or DIG
regulator outputs.
28
Tel: [phone] Fax: [phone] E-mail: [e-mail] http://www.hoperf.com