GS81313LT18 Datasheet, PDF (27/29 Pages) GSI Technology – 144Mb SigmaDDR-IIIe™ Burst of 2 ECCRAM™

GS81313LT18/36GK-833/714/625
260-Pin BGA Package Drawing (Package GK)
Ø0.08 S C
Ø0.22 S C A S B S
PIN #1 CORNER
Ø0.50~Ø0.70(260x)
13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
B
A
0.05(4X)
13.20  0.05
14.00  0.05
1.00
12.00
HEAT SPREADER
4–R0.5 (MAX)
C SEATING PLANE
Ball Pitch:
Ball Diameter:
1.00 Substrate Thickness: 0.51
0.60 Mold Thickness:
—
Rev: 1.13 7/2016
27/29
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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