MSC8252 Datasheet, PDF (64/68 Pages) Freescale Semiconductor, Inc – orderDual-Core Digital Signal Processor

Package Information
5 Package Information
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURE PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DETERMINED BY THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
6. ALL DIMENSIONS ARE SYMMETRIC ACROSS THE PACKAGE CENTER LINES, UNLESS DIMENSIONED
OTHERWISE.
7. 29.2MM MAXIMUM PACKAGE ASSEMBLY (LID + LAMINATE) X AND Y.
Figure 40. MSC8252 Mechanical Information, 783-ball FC-PBGA Package
MSC8252 Dual-Core Digital Signal Processor Data Sheet, Rev. 3
64
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