MC33662LEF Datasheet, PDF (6/31 Pages) Freescale Semiconductor, Inc – LIN 2.1 / SAEJ2602-2, LIN Physical Layer

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS (CONTINUED)
ESD Capability - AECQ100
V
Human Body Model - JESD22/A114 (C_ZAP = 100 pF, R_ZAP = 1500 )
LIN pin versus GND
Wake pin versus GND
V_ESD1-1
V_ESD1-2
± 10.0 k
± 8.0 k
All other pins
V_ESD1-4
± 4.0 k
Charge Device Model - JESD22/C101 (C_ZAP = 4.0 pF
Corner pins (Pins 1, 4, 5 and 8)
V_ESD2-1
± 750
All other pins (Pins 2, 3, 6 and 7)
Machine Model - JESD22/A115 (C_ZAP = 220 pF, R_ZAP = 0 )
All pins
V_ESD2-2
V_ESD3-1
± 500
± 200
According to “Hardware Requirements for LIN, CAN and Flexray Interfaces in
Automotive Applications” specification Rev1.1 / December 2nd, 2009 (C_ZAP = 150 pF,
R_ZAP = 330 )
Contact Discharge, Unpowered
LIN pin without capacitor
LIN pin with 220 pF capacitor
VSUP (10 µF to ground)
WAKE (2*18 k serial resistor)
INH pin
LIN pin with 220 pF capacitor and indirect ESD coupling (according to ISO10605
- Annex F)
V_ESD4-1
V_ESD4-2
V_ESD4-3
V_ESD4-4
V_ESD4-5
V_ESD4-6
± 15 k
± 15 k
±25 k
±20 k
±2.0 k
>± 15 k
According to ISO10605 - Rev 2008 test specification
(2.0 k / 150 pF) - Unpowered - Contact discharge
LIN pin without capacitor
LIN pin with 220 pF capacitor
VSUP (10 µF to ground)
WAKE (2*18 k serial resistor)
(2.0 k / 330 pF) - Powered - Contact discharge
LIN pin without capacitor
LIN pin with 220 pF capacitor
VSUP (10 µF to ground)
WAKE (2*18 k serial resistor)
V_ESD5-1
V_ESD5-2
V_ESD5-3
V_ESD5-4
V_ESD6-1
V_ESD6-2
V_ESD6-3
V_ESD6-4
± 20 k
± 25 k
±25 k
±25 k
±8 k
± 10 k
±12 k
±15 k
THERMAL RATINGS
Operating Temperature
Ambient
Junction
C
T_A
- 40 to 125
T_J
- 40 to 150
Storage Temperature
T_STG
- 40 to 150
C
Thermal Resistance, Junction to Ambient
Peak Package Reflow Temperature During Solder Mounting ⁽⁴⁾
R_JA
T_SOLDER
150
°C/W
240
°C
Thermal Shutdown Temperature
T_SHUT
150 to 200
°C
Thermal Shutdown Hysteresis Temperature
T_HYST
20
°C
Notes
4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
33662
6
Analog Integrated Circuit Device Data
Freescale Semiconductor