MC9S08SH32 Datasheet, PDF (315/328 Pages) Freescale Semiconductor, Inc – Microcontrollers

Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08SH32 and MC9S08SH16 devices.
Jennifer
Table B-1. Device Numbering System
Device Number¹
Memory
Flash
RAM
28-Pin
Available Packages²
20-Pin
MC9S08SH32
MC9S08SH16
32 K
16
1024 B
1024 B
28 TSSOP
28 SOIC
1 _{See Table 1-1for a complete description of modules included on each device.}
2 _{See Table B-2 for package information.}
20 TSSOP
16-Pin
16 TSSOP
B.1.1 Device Numbering Scheme
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Status
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Core
Family
- SH
MC 9 S08 SH n C xx R
Memory Size
- 32 Kbytes
- 16 Kbytes
Tape and Reel Suffix (optiona
- R = Tape and Reel
Package Designator
Two letter descriptor (refer to
Table B-2).
Temperature Option
- C = –40 to 85 °C
- M = –40 to 125 °C
Figure B-1. MC9S08SH32 Device Numbering Scheme
MC9S08SH32 Series Data Sheet, Rev. 2
Freescale Semiconductor
315
PRELIMINARY