K30P64M72SF1 Datasheet, PDF (21/68 Pages) Freescale Semiconductor, Inc – K30 Sub-Family

5.4.1 Thermal operating requirements
Table 10. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
–40
–40
Max.
125
105
General
Unit
°C
°C
5.4.2 Thermal attributes
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p) R_θJA
Single-layer (1s) R_θJMA
Four-layer (2s2p) R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
64 LQFP
Thermal
59
resistance, junction
to ambient (natural
convection)
Thermal
41
resistance, junction
to ambient (natural
convection)
Thermal
48
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
35
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
23
resistance, junction
to board
Thermal
11
resistance, junction
to case
Thermal
3
characterization
parameter, junction
to package top
outside center
(natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 3
1,3
1,3
4
5
6
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
3.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal. For the LQFP, the board meets the JESD51-7
specification.
4.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
K30 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc.
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