K30P64M72SF1 Datasheet, PDF (2/68 Pages) Freescale Semiconductor, Inc – K30 Sub-Family

Table of Contents
1 Ordering parts...........................................................................3
5.4.2 Thermal attributes.................................................21
1.1 Determining valid orderable parts......................................3
6 Peripheral operating requirements and behaviors....................22
2 Part identification......................................................................3
6.1 Core modules....................................................................22
2.1 Description.........................................................................3
6.1.1 Debug trace timing specifications.........................22
2.2 Format...............................................................................3
6.1.2 JTAG electricals....................................................22
2.3 Fields.................................................................................3
6.2 System modules................................................................25
2.4 Example............................................................................4
6.3 Clock modules...................................................................25
3 Terminology and guidelines......................................................4
6.3.1 MCG specifications...............................................25
3.1 Definition: Operating requirement......................................4
6.3.2 Oscillator electrical specifications.........................27
3.2 Definition: Operating behavior...........................................5
6.3.3 32kHz Oscillator Electrical Characteristics............29
3.3 Definition: Attribute............................................................5
6.4 Memories and memory interfaces.....................................30
3.4 Definition: Rating...............................................................6
6.4.1 Flash electrical specifications................................30
3.5 Result of exceeding a rating..............................................6
6.4.2 EzPort Switching Specifications............................35
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................36
requirements......................................................................6
6.6 Analog...............................................................................36
3.7 Guidelines for ratings and operating requirements............7
6.6.1 ADC electrical specifications.................................36
3.8 Definition: Typical value.....................................................7
6.6.2 CMP and 6-bit DAC electrical specifications.........44
3.9 Typical value conditions....................................................8
6.6.3 12-bit DAC electrical characteristics.....................47
4 Ratings......................................................................................9
6.6.4 Voltage reference electrical specifications............50
4.1 Thermal handling ratings...................................................9
6.7 Timers................................................................................51
4.2 Moisture handling ratings..................................................9
6.8 Communication interfaces.................................................52
4.3 ESD handling ratings.........................................................9
6.8.1 CAN switching specifications................................52
4.4 Voltage and current operating ratings...............................9
6.8.2 DSPI switching specifications (limited voltage
5 General.....................................................................................10
range)....................................................................52
5.1 AC electrical characteristics..............................................10
6.8.3 DSPI switching specifications (full voltage range).53
5.2 Nonswitching electrical specifications...............................10
6.8.4 I2C switching specifications..................................55
5.2.1 Voltage and current operating requirements.........10
6.8.5 UART switching specifications..............................55
5.2.2 LVD and POR operating requirements.................12
6.8.6 I2S/SAI Switching Specifications..........................55
5.2.3 Voltage and current operating behaviors..............12
6.9 Human-machine interfaces (HMI)......................................60
5.2.4 Power mode transition operating behaviors..........13
6.9.1 TSI electrical specifications...................................60
5.2.5 Power consumption operating behaviors..............14
6.9.2 LCD electrical characteristics................................61
5.2.6 Designing with radiated emissions in mind...........18
7 Dimensions...............................................................................62
5.2.7 Capacitance attributes..........................................18
7.1 Obtaining package dimensions.........................................62
5.3 Switching specifications.....................................................19
8 Pinout........................................................................................63
5.3.1 Device clock specifications...................................19
8.1 K30 Signal Multiplexing and Pin Assignments..................63
5.3.2 General switching specifications...........................19
8.2 K30 Pinouts.......................................................................66
5.4 Thermal specifications.......................................................20
9 Revision History........................................................................67
5.4.1 Thermal operating requirements...........................20
K30 Sub-Family Data Sheet, Rev. 2, 4/2012.
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Freescale Semiconductor, Inc.