K60P104M100SF2 Datasheet, PDF (20/67 Pages) Freescale Semiconductor, Inc – K60 Sub-Family Data Sheet

Peripheral operating requirements and behaviors
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.3.2 Thermal attributes
Board
type
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Symbol
R_θJA
R_θJA
R_θJMA
Description
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
y ₁₀₄
100
r ^{MAPBGA LQFP}
TBD
TBD
Unit
°C/W
a _TBD
TBD
°C/W
in^TBD
TBD
°C/W
Notes
1
1
1
Four-layer
(2s2p)
—
lim ^—
6 Peripheral oper_Pating^rre^equirements and behaviors ^—
R_θJMA
R_θJB
R_θJC
Ψ_JT
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
°C/W
°C/W
°C/W
°C/W
1
2
3
4
6.1 Core modules
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
K60 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
20
Preliminary
Freescale Semiconductor, Inc.