English
Language : 

EP7312 Datasheet, PDF (30/64 Pages) Cirrus Logic – HIGH-PERFORMANCE, LOW-POWER SYSTEM ON CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
EP7312
High-Performance, Low-Power System on Chip
Packages
208-Pin LQFP Package Characteristics
29.60 (1.165)
30.40 (1.197)
27.80 (1.094)
28.20 (1.110)
0.17 (0.007)
0.27 (0.011)
29.60 (1.165)
30.40 (1.197)
0.50
(0.0197)
BSC
Pin 208
Pin 1
EP7312
208-Pin LQFP
Pin 1 Indicator
27.80 (1.094)
28.20 (1.110)
0.45 (0.018)
0.75 (0.030)
1.35 (0.053)
1.45 (0.057)
1.00 (0.039) BSC
0.09 (0.004)
0.20 (0.008)
1.40 (0.055)
1.60 (0.063)
0.05 (0.002)
0.15 (0.006)
0° MIN
7° MAX
Figure 15. 208-Pin LQFP Package Outline Drawing
Note:
1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.
2) Drawing above does not reflect exact package pin count.
3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.
4) For pin locations, please see Figure 16. For pin descriptions see the EP7312 User’s Manual.
30
©Copyright Cirrus Logic, Inc. 2003
(All Rights Reserved)
DS508PP5