PS-AT65609EHW Datasheet, PDF (3/30 Pages) ATMEL Corporation – MICROCIRCUIT, DIGITAL, MEMORY, 8K x 8-Bit, 5V Very Low Power CMOS SRAM, MONOLITHIC SILICON

PS-AT65609EHW
Rev A
SUMMARY
1 GENERAL ............................................................................................................................................................................5
1.1 SCOPE .............................................................................................................................................................................5
1.2 IDENTIFICATION ..............................................................................................................................................................5
1.3 ABSOLUTE MAXIMUM RATINGS .......................................................................................................................................5
1.4 RECOMMENDED OPERATING CONDITIONS........................................................................................................................5
1.5 RADIATION FEATURES.....................................................................................................................................................5
1.6 HANDLING PRECAUTIONS ................................................................................................................................................5
2 APPLICABLE DOCUMENTS ...........................................................................................................................................6
3 REQUIREMENTS ...............................................................................................................................................................6
3.1 DESIGN, CONSTRUCTION, AND PHYSICAL DIMENSIONS. ...................................................................................................6
3.1.1 Timing waveforms ..................................................................................................................................................6
3.1.2 Package type...........................................................................................................................................................6
3.1.3 Terminal connections .............................................................................................................................................6
3.1.4 Block diagram ........................................................................................................................................................6
3.2 MARKING ........................................................................................................................................................................6
3.2.1 Lead Identification..................................................................................................................................................6
3.2.2 Component Number................................................................................................................................................6
3.2.3 Traceability Information.........................................................................................................................................7
3.3 ELECTRICAL CHARACTERISTICS ......................................................................................................................................7
3.4 BURN-IN TEST .................................................................................................................................................................7
3.4.1 Electrical circuit.....................................................................................................................................................7
3.4.2 Parameters drift value ............................................................................................................................................7
3.5 ENVIRONMENTAL AND ENDURANCE TESTS.....................................................................................................................7
3.5.1 Electrical Circuit for Operating Life Test ..............................................................................................................7
3.5.2 Electrical Measurements at Completion of Environmental and endurance tests ...................................................7
3.5.3 Conditions for Operating Life Test.........................................................................................................................7
3.6 TOTAL DOSE IRRADIATION TESTING ................................................................................................................................7
3.6.1 Bias Conditions ......................................................................................................................................................7
3.6.2 Electrical Measurements ........................................................................................................................................7
4 QUALITY ASSURANCE PROVISIONS ..........................................................................................................................7
4.1 WAFER LOT VALIDATION.................................................................................................................................................7
4.2 SAMPLING AND INSPECTION. ...........................................................................................................................................8
4.3 SCREENING......................................................................................................................................................................8
4.4 QUALITY CONFORMANCE INSPECTION.............................................................................................................................8
4.4.1 Group A inspection.................................................................................................................................................8
4.4.2 Group C inspection.................................................................................................................................................8
4.4.3 Group D inspection. ...............................................................................................................................................8
4.5 DELTA MEASUREMENTS ..................................................................................................................................................8
5 PACKAGING .......................................................................................................................................................................8
5.1 PACKAGING REQUIREMENTS ...........................................................................................................................................8
6 ANNEXES.............................................................................................................................................................................9
6.1 ELECTRICAL AND TIMING CHARACTERISTICS ..................................................................................................................9
6.2 PARAMETER DRIFT VALUES ...........................................................................................................................................18
6.3 TIMING WAVEFORMS.....................................................................................................................................................19
6.3.1 AC Test Conditions:..............................................................................................................................................19
6.3.2 AC Test Loads Waveforms....................................................................................................................................19
6.3.3 Data Retention Mode............................................................................................................................................20
6.3.4 Write cycles ..........................................................................................................................................................21
6.3.5 Read cycles ...........................................................................................................................................................23
6.4 CASE OUTLINE...............................................................................................................................................................24
6.4.1 Package drawing ..................................................................................................................................................24
3/30