TMD2725 Datasheet, PDF (43/50 Pages) ams AG – The device features advanced proximity measurement

TMD2725 − Soldering & Storage Information
Storage Information
Moisture Sensitivity Optical characteristics of the device can be
adversely affected during the soldering process by the release
and vaporization of moisture that has been previously
absorbed into the package. To ensure the package contains the
smallest amount of absorbed moisture possible, each device is
baked prior to being dry packed for shipping. Devices are dry
packed in a sealed aluminized envelope called a
moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: <40°C
• Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life and the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: <30°C
• Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
ams Datasheet
[v1-11] 2016-Sep-20
Page 43
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