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| TMD2725 Datasheet, PDF (42/50 Pages) ams AG – The device features advanced proximity measurement | |||
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TMD2725 â Soldering&StorageInformation
Soldering & Storage
Information
Figure 58:
Solder Reflow Profile
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The solder reflow
profile describes the expected maximum heat exposure of
components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The
components should be limited to a maximum of three passes
through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217°C (T1)
Time above 230°C (T2)
Time above Tpeak - 10°C (T3)
Peak temperature in reflow
Temperature gradient in cooling
Reference
tSOAK
t1
t2
t3
Tpeak
Device
2.5°C/s
2 to 3 minutes
Max 60s
Max 50s
Max 10s
260°C
Max - 5°C/s
Figure 59:
Solder Reflow Profile Graph
Tpeak
T3
T2
T1
Not to scale â for reference only
Time (s)ec)
tsoak
Page 42
Document Feedback
t3
t2
t1
ams Datasheet
[v1-11] 2016-Sep-20
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