WM8962B Datasheet, PDF (288/295 Pages) Wolfson Microelectronics plc – Ultra-Low Power Stereo CODEC with Audio Enhancement DSP, 1W Stereo Class D Speaker Drivers and Ground Referenced Headphone Drivers

PACKAGE DIMENSIONS
PACKAGE DIAGRAM FOR DEVICES MARKED KBC
B: 49 BALL W-CSP PACKAGE 3.594 X 3.984 X 0.7mm BODY, 0.50 mm BALL PITCH
WM8962
DM075.B
2
A
A2
DETAIL 1
7
6
5
4
3
2
1
A
B
4
A1
CORNER
C
e
D
E1
5
E
F
G
DETAIL 2
e
D1
BOTTOM VIEW
2X
2X
0.10 Z
0.10 Z
bbb Z
1
Z
A1
DETAIL 2
6
D
E
TOP VIEW
f1
SOLDER BALL
f2
h
Symbols
A
A1
A2
D
D1
E
E1
e
f1
f2
h
MIN
0.650
0.219
0.431
3.564
3.954
0.297
0.492
Dimensions (mm)
NOM
MAX
0.7
0.750
0.244
0.269
0.456
0.481
3.594
3.624
3.00 BSC
3.984
4.014
3.00 BSC
0.50 BSC
0.314
BSC
NOTE
5
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
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Rev 4.3