LP3907_14 Datasheet, PDF (7/57 Pages) Texas Instruments – Dual High-Current Step-Down DC/DC and Dual Linear Regulator with I2C-Compatible Interface

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LP3907
SNVS511N – JUNE 2007 – REVISED AUGUST 2011
Operating Ratings: Bucks ^{(1) (2) (3) (4)}
V_IN
V_EN
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range ⁽⁵⁾
2.8V to 5.5V
0 to (V_IN + 0.3V)
−40°C to +125°C
−40°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics.
(2) All voltages are with respect to the potential at the GND pin.
(3) Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the
most likely norm.
(4) Buck V_IN ≥ V_OUT + 1V.
(5) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
Thermal Properties^{(6) (7) (8)}
Junction-to-Ambient Thermal Resistance (θ_JA) SQA024AE
Junction-to-Ambient Thermal Resistance (θ_JA) TLA25AAA
28°C/W
51°C/W
(6) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typ.) and
disengages at T_J = 140°C (typ.)
(7) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (θ_JA × P_D-MAX). See Applications section.
(8) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
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