LP3907_14 Datasheet, PDF (6/57 Pages) Texas Instruments – Dual High-Current Step-Down DC/DC and Dual Linear Regulator with I2C-Compatible Interface

LP3907
SNVS511N – JUNE 2007 – REVISED AUGUST 2011
www.ti.com
LLP Pin
No.
16
17
18
19
micro SMD
pin no.
C2
B2
B1
A1
20
A2
21
B3
22
A3
23
A4
24
A5
DAP
Name
SDA
SCL
GND_L
VINLDO1
LDO1
ENLDO1
ENLDO2
LDO2
VINLDO2
DAP
Table 2. Pin Descriptions (continued)
I/O
I/O
I
G
I
O
I
I
O
I
GND
Type
D
D
G
PWR
PWR
D
D
PWR
PWR
GND
Description
I²C Data (bidirectional)
I²C Clock
LDO ground
Power in from either DC source or battery to input terminal to
LDO1
LDO1 Output
LDO1 enable pin, a logic HIGH enables the LDO1
LDO2 enable pin, a logic HIGH enables the LDO2
LDO2 Output
Power in from either DC source or battery to input terminal to
LDO2.
Connection isn't necessary for electrical performance, but it is
recommended for better thermal dissipation.
Power Block Input
VINLDO12
AVDD
VIN1
VIN2
LDO 1
LDO 2
Power Block Operation
Enabled
Disabled
VIN+
VIN+
VIN+
VIN+
VIN+
VIN+ or 0V
VIN+
VIN+ or 0V
≤ VIN+
≤ VIN+
≤ VIN+
≤ VIN+
Note
Always Powered
Always Powered
If Enabled, Min Vin is 1.74V
If Enabled, Min Vin is 1.74V
VIN+ is the largest potential voltage on the device.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ^{(1) (2)}
V_IN, SDA, SCL
GND to GND SLUG
Power Dissipation (P_{D_MAX})
(T_A=85°C, T_MAX=125°C, )⁽³⁾
Junction Temperature (T_J-MAX)
Storage Temperature Range
Maximum Lead Temperature (Soldering)
ESD Ratings
Human Body Model
(4)
−0.3V to +6V
±0.3V
1.43W
150°C
−65°C to +150°C
260°C
2kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (θ_JA × P_D-MAX). See Applications section.
(4) The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. (MILSTD - 883 3015.7)
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