LP3907_14 Datasheet, PDF (4/57 Pages) Texas Instruments – Dual High-Current Step-Down DC/DC and Dual Linear Regulator with I2C-Compatible Interface

LP3907
SNVS511N – JUNE 2007 – REVISED AUGUST 2011
Connection Diagrams and Package Mark Information
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Figure 3. 24-Lead LLP Package (top view
NOTE
The physical placement of the package marking will vary from part to part.
(*) UZXYTT format: ‘U’ – wafer fab code; ‘Z’ – assembly code; ’XY’ 2 digit date code;
‘TT” – die run code. See http://www.national.com/quality/marking_conventions.html for
more information on marking information.
(**) Package received will have XXXX replaced with the specific part version ordered.
25-Bump Thin Micro SMD Package, Large Bump National Package Number TLA25AAA
5
VIN
LDO2
VIN
LDO12
GND_S
W1
SW1
VIN1
4 LDO2
VIN
LDO12
EN_T
EN_S
W1
FB1
3
EN_
LDO2
EN_
LDO1
nPOR
GND_C
AVDD
2
LDO1
SCL
SDA
EN_
SW2
FB2
1
VIN
LDO1
GND_
L
GND_
SW2
SW2
VIN2
A
B
C
D
E
Figure 4. Top View
4
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