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CC2564MODN Datasheet, PDF (7/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module
www.ti.com
CC2564MODN, CC2564MODA
SWRS160D – FEBRUARY 2014 – REVISED DECEMBER 2015
4 Specifications
Unless otherwise indicated, all measurements are taken at the device pins of the TI test evaluation board
(EVB). All specifications are over process, voltage, and temperature, unless otherwise indicated.
All values apply to the CC2564MODA and CC2564MODN devices, unless otherwise indicated.
4.1 Absolute Maximum Ratings(1)
Over operating free-air temperature range (unless otherwise indicated). All parameters are measured as follows: VDD_IN =
3.6 V and VDD_IO = 1.8 V (unless otherwise indicated).
PARAMETERS
MIN
MAX
UNIT
VDD_IN
Supply voltage range
–0.5
4.8
V
VDD_IO
Input voltage to analog pins(1)
–0.5
2.145
V
–0.5
2.1
V
Input voltage to all other pins
Operating ambient temperature range(2)
–0.5 VDD_IO + 0.5
V
–30
85
°C
Bluetooth RF inputs
10
dBm
Storage temperature range, Tstg
–40
100
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) Analog pin: BT_ANT
(2) The module supports a temperature range of –30°C to 85°C because of the operating conditions of the crystal.
4.2 ESD Ratings
V(ESD) electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22- ±YYY V
C101 (2)
VALUE
±500
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
4.3 Power-On Hours(1)
CC2564MODx
DEVICE
CONDITIONS
Duty Cycle = 25% active and 75% sleep
Tambient = 70ºC
POWER-ON HOURS
15,400 (7 Years)
(1) This information is provided solely to give the customer an estimation of the POH under certain specified conditions, and is not intended
to – and does not – extend the warranty for the device under TI’s Standard Terms and Conditions.
4.4 Recommended Operating Conditions
RATING
Power supply voltage
I/O power supply voltage
High-level input voltage
Low-level input voltage
I/O input rise and fall times,10% to 90% — asynchronous mode
I/O input rise and fall times, 10% to 90% — synchronous mode (PCM)
Voltage dips on VDD_IN (VBAT)
duration = 577 μs to 2.31 ms, period = 4.6 ms
Maximum ambient operating temperature (1)
CONDITION
Default
Default
SYM
VDD_IN
VDD_IO
VIH
VIL
tr and tf
MIN
2.2
1.62
0.65 x VDD_IO
0
1
1
–30
(1) A crystal-based solution is limited by the temperature range required for the crystal to meet 20 ppm.
MAX
4.8
1.92
VDD_IO
0.35 x VDD_IO
10
2.5
400
85
UNIT
V
V
V
V
ns
ns
mV
°C
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Specifications
7