CC2564MODN Datasheet, PDF (1/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module

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CC2564MODN, CC2564MODA
SWRS160D – FEBRUARY 2014 – REVISED DECEMBER 2015
CC2564MODx Bluetooth^® Host Controller Interface (HCI) Module
1 Device Overview
1.1 Features
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• Module Solution Based on TI's CC2564B Dual-
Mode Bluetooth Single Chip With Bluetooth Basic
Rate (BR), Enhanced Data Rate (EDR) and Low
Energy (LE) Support; Available in Two Variants:
– CC2564MODA With Integrated Antenna
– CC2564MODN With External Antenna
• Fully Certified Bluetooth 4.1 Module
– FCC (Z64-2564N)/IC (451I-2564N) Modular
Grant (see Section 6.2.1.3, Antenna,
Section 7.1.1, FCC Certification, and
Section 7.1.2 IC Certification)
– CE Certified as Summarized in the Declaration
of Conformity (see Section 7.1.3, ETSI/CE
Certification)
– Bluetooth 4.1 Controller Subsystem Qualified
(CC2564MODN: QDID 55257; CC2564MODA:
QDID 64631). Compliant up to the HCI Layer
• Highly Optimized for Design Into Small Form
Factor Systems and Flexibility:
– CC2564MODA
• Integrated Chip Antenna
• Module Footprint: 35 Terminals, 0.8-mm
Pitch, 7 mm × 14 mm × 1.4 mm (Typ)
– CC2564MODN
• Single-Ended 50-Ω RF Interface
• Module Footprint: 33 Terminals, 0.8-mm
Pitch, 7 mm × 7 mm × 1.4 mm (Typ)
• BR/EDR Features Include:
– Up to 7 Active Devices
– Scatternet: Up to 3 Piconets Simultaneously, 1
as Master and 2 as Slaves
– Up to 2 SCO Links on the Same Piconet
– Support for All Voice Air-Coding – Continuously
Variable Slope Delta (CVSD), A-Law, μ-Law,
and Transparent (Uncoded)
– Assisted Mode for HFP 1.6 Wideband Speech
(WBS) Profile or A2DP Profile to Reduce Host
Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• LE Features Include:
– Support of Up to 10 Simultaneous Connections
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for LE Allows Large
Numbers of Multiple Connections Without
Affecting BR/EDR Performance.
– Built-In Coexistence and Prioritization Handling
for BR/EDR and LE
• Best-in-Class Bluetooth (RF) Performance
(TX Power, RX Sensitivity, Blocking)
– Class 1.5 TX Power Up to +10 dBm
– –93 dbm Typical RX Sensitivity
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Provides Longer Range, Including 2x Range
Over Other LE-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
• UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
• Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps
– Fully Programmable Digital PCM-I2S Codec
Interface
• Flexibility for Easy Stack Integration and Validation
Into Various Microcontrollers, Such as MSP430™
and ARM^® Cortex^®-M3 and Cortex^®-M4 MCUs
• CC256x Bluetooth Hardware Evaluation Tool: PC-
Based Application to Evaluate RF Performance of
the Device and Configure Service Pack
• Lead-Free Design Compliant With RoHS
Requirements
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.