CC2564MODN Datasheet, PDF (30/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module

CC2564MODN, CC2564MODA
SWRS160D – FEBRUARY 2014 – REVISED DECEMBER 2015
Figure 6-2 shows the reference schematics for the CC2564MODA module.
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Figure 6-2. CC2564MODA Reference Schematics
6.2 Layout
This section provides the printed circuit board (PCB) layout rules and considerations, including component
placement and routing guidelines, when designing a board with the CC2564MODx module.
The integrator of the CC2564MODx module must comply with the PCB layout recommendations described
in the following subsections to preserve the FCC and Industry Canada (IC) modular radio certification.
Moreover, TI recommends customers follow the guidelines described in this section to achieve similar
performance to that obtained with the TI reference design.
6.2.1 Layout Guidelines
6.2.1.1 PCB Stack-Up
The recommended PCB stack-up is a four-layer design based on a standard flame-retardant 4 (FR4)
material (see Figure 6-3):
Layer 1 (TOP – RF + Signal) Use layer 1 to place the module on and to route signal traces. In particular,
the RF trace must be run on this layer.
Layer 2 (L2 – Ground) Layer 2 must be a solid ground layer.
Layer 3 (L3 – Power) Use layer 3 to route power traces or place power planes.
Layer 4 (BOTTOM – Signal) Use layer 4 as a second routable layer to run signal traces (except RF
signals).
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Applications, Implementation, and Layout
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