CC2564MODN Datasheet, PDF (52/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module

MOG0035A
EXAMPLE STENCIL DESIGN
QFM - 1.54 mm max height
QUAD FLAT MODULE
4X (0.8)
4X (0.8)
30 ²⁴
8X (6.55)
2X (4.5)
10X (0.9)
19
1
10X (0.9)
2
2X (4.5)
28
25
29
27
(3.05)
26
6
31
7
28X ( 0.5)
SEE PAD DETAIL
12
2X (1.6)
(3.5)
8X (0.45)
33
18
2X METAL
4X (2.325)
35
2X (1.6)
(R0.05)
TYP
13
34
32
2X (3.163)
2X (5.688)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PADS 25-29: 90% PRINTED SOLDER COVERAGE BY AREA
PADS 34 & 35: 96% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
2X (0.4)
(3.15)
PKG
(3.135)
2X (0.43)
(R0.05) TYP
( 0.95)
METAL
ALL AROUND
PAD DETAIL
4X,SCALE:25X
4221869/A 07/2015
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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