CC2564MODN Datasheet, PDF (51/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module

MOG0035A
EXAMPLE BOARD LAYOUT
QFM - 1.54 mm max height
QUAD FLAT MODULE
PKG
4X (0.8)
4X (0.8)
30 ²⁴
8X (6.55)
2X (4.5)
10X (0.9)
19
1
10X (0.9)
2
2X (4.5)
28
25
29
27
8X (0.45)
33
18
2X (1.6)
2X (4.85)
35
5X ( 1)
(3.05)
26
6
(R0.05) TYP
13
34
31
7
32
12
28X ( 0.5)
2X (1.6)
( 0.2) VIA
TYP
(3.5)
2X (4.425)
LAND PATTERN EXAMPLE
SCALE:8X
(0.4)
(3.15)
PKG
(3.135)
(0.43)
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NOTES: (continued)
4221869/A 07/2015
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com