CC2564MODN Datasheet, PDF (31/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module

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CC2564MODN, CC2564MODA
SWRS160D – FEBRUARY 2014 – REVISED DECEMBER 2015
Figure 6-3. PCB Stack-Up
TI recommends a board thickness of 62.4 mils and a substrate dielectric of 4.2. For details, see Table 6-1.
NOTE
These parameters are used for the 50-Ω impedance matching of the RF trace. For more
information, see Section 6.2.1.2, RF Interface Guidelines.
Solder mask
TOP copper + plating
PP (substrate)
L2 copper + plating
Core (substrate)
L3 copper + plating
PP (substrate)
Bottom copper + plating
Solder mask
Final thickness
ITEM
Table 6-1. Recommended PCB Properties
VALUE
0.4 mil
1 oz/1.4 mil
10 mil
1 oz/1.4 mil
36 mil
1 oz/1.4 mil
10 mil
1 oz/1.4 mil
0.4 mil
62.4 mil = 1.585 mm
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Applications, Implementation, and Layout
31
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