CC2564MODN Datasheet, PDF (47/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module

MOE0033A
EXAMPLE BOARD LAYOUT
QFM - 1.4 mm max height
QUAD FLAT MODULE
4X (0.85)
30
1
4X (3.1)
2X (4.5)
SYMM
4X (3.1)
24
2X (4.5)
SYMM
28
25
27
29
10X (0.9)
19
33
18
(R0.05)
TYP
2X
(3.15)
I/O PADS
2X (1.6)
10X (0.9)
6
4X (0.85)
31
4X ( 0.5)
26
( 0.2) VIA
TYP
7
2X (3.15)
I/O PADS
12
2X (1.6)
LAND PATTERN EXAMPLE
SCALE:12X
5X ( 1.1)
13
24X (0.5)
32
24X (0.6)
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
DEFINED
SOLDER MASK
OPENING
NOTES: (continued)
4222156/A 12/2015
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com