CC2564MODN Datasheet, PDF (48/62 Pages) Texas Instruments – Bluetooth Host Controller Interface (HCI) Module

MOE0033A
EXAMPLE STENCIL DESIGN
QFM - 1.4 mm max height
QUAD FLAT MODULE
4X (0.85)
30
1
4X (3.1)
2X (4.5)
SYMM
10X (0.9)
6
4X (0.85)
31
4X ( 0.5)
4X (3.1)
24
2X (4.5)
SYMM
10X (0.9)
19
33
28
25
27
29
18
2X
(3.15)
I/O PADS
2X (1.6)
(R0.05)
TYP
26
13
7
2X (3.15)
I/O PADS
2X (1.6)
24X (0.5)
32
12
24X (0.6)
SEE PAD DETAIL
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA
PADS 25-29: 90%
SCALE:12X
(R0.05) TYP
( 1.044)
METAL
ALL AROUND
CENTER PAD DETAIL
5X,SCALE:25X
4222156/A 12/2015
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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