LP3907-Q1 Datasheet, PDF (6/53 Pages) Texas Instruments – Dual High-Current Step-Down DC-DC And Dual Linear Regulator

LP3907-Q1
SNVSA55A – DECEMBER 2014 – REVISED MAY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
V_IN, SDA, SCL
GND to GND SLUG
Power dissipation (WQFN (RTW))⁽³⁾
Power dissipation (DSBGA (YZR))^{(3) (4)}
Junction temperature (T_J-MAX)
Maximum lead temperature (soldering)
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
6
V
±0.3
1.43
W
0.78
150
260
°C
−65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (R_θJA × P_D-MAX).
(4) For T_A = 85°C, T_J-MAX = 125°C.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±2000
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions (Bucks)
over operating free-air temperature range (unless otherwise noted)^(1)(2)(3)(4)
MIN
NOM
MAX UNIT
V_IN
V_EN
Junction temperature (T_J)
Ambient temperature (T_A) ⁽⁵⁾
2.8
5.5
V
0
(V_IN + 0.3 V)
−40
125
°C
−40
125
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Minimum (Min) and Maximum (Max) limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do
represent the most likely norm.
(4) Buck V_IN ≥ V_OUT + 1V.
(5) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
6
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