TLC320AD50C-I_15 Datasheet, PDF (50/57 Pages) Texas Instruments – SIGMA-DELTA ANALOG INTERFACE CIRCUITS WITH MASTER-SLAVE FUNCTION

PACKAGE OPTION ADDENDUM
www.ti.com
24-Sep-2015
PACKAGING INFORMATION
Orderable Device
TLC320AD50CDW
TLC320AD50CPT
TLC320AD50CPTR
TLC320AD50IDW
TLC320AD52CDW
TLC320AD52CDWR
TLC320AD52CPT
TLC320AD52CPTR
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE
SOIC
DW 28
20 Green (RoHS
& no Sb/Br)
ACTIVE
LQFP
PT
48 250 Green (RoHS
& no Sb/Br)
ACTIVE
LQFP
PT
48 1000 Green (RoHS
& no Sb/Br)
ACTIVE
SOIC
DW 28
20 Green (RoHS
& no Sb/Br)
OBSOLETE SOIC
DW 28
TBD
OBSOLETE SOIC
DW 28
TBD
OBSOLETE LQFP
PT
48
TBD
OBSOLETE LQFP
PT
48
TBD
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Call TI
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Call TI
MSL Peak Temp Op Temp (°C)
(3)
Level-1-260C-UNLIM
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-1-260C-UNLIM -40 to 85
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
0 to 70
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
TLC320AD50C
P320AD50
P320AD50
TLC320AD50I
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
Samples
Addendum-Page 1