BQ24187 Datasheet, PDF (5/44 Pages) Texas Instruments – 1A USB-OTG Support

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7 Specifications
Not Recommended for New Designs
bq24187
SLUSBM0 – APRIL 2014
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
IN
Terminal voltage range (with
respect to PGND)
BOOT
SW
SDA, SCL, CS+, BAT, STAT, DRV, TS, PSEL, INT
BOOT to SW
Output Current (Continuous)
SW
CS+, BAT (charging)
Input Current (Continuous)
Output Sink Current
STAT, INT
Operating free-air temperature range
Junction temperature, T_J
MIN MAX UNIT
–1.3
30 V
–0.3
30 V
–0.7
20 V
–0.3
5V
–0.3
5V
4.5 A
3.5 A
2.75 A
10 mA
–40
85 °C
–40
125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
T_STG
Storage temperature range
MIN
MAX
UNIT
–65
150
°C
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
IN voltage
V_IN
IN operating voltage
MIN
MAX UNIT
4.2
28 ⁽¹⁾
V
4.2
6.0
I_IN
Input current, IN input
I_SW
Ouput Current from SW, DC
I_BAT
Charge Current
T_J
Operating junction temperature, T_J
2.5 A
2A
2A
0
125 °C
(1) The inherent switching noise voltage spikes should not exceed the absolute maximum rating on either the BOOST or SW terminals. A
tight layout minimizes switching noise.
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq24187
YFF
RGE
UNIT
36 TERMINALS 24 TERMINALS
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
R_θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
55.8
32.6
0.5
30.5
10
3.3
°C/W
2.6
0.4
9.9
9.3
N/A
2.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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