BQ24187 Datasheet, PDF (42/44 Pages) Texas Instruments – 1A USB-OTG Support

YFF0036
EXAMPLE BOARD LAYOUT
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
36X ( 0.23)
(0.4) TYP
1
23
4
5
6
A
(0.4) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
SCALE:25X
( 0.23)
METAL
0.05 MAX
0.05 MIN
( 0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
METAL UNDER
SOLDER MASK
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
4222008/A 03/2015
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