CC2640R2F Datasheet, PDF (47/64 Pages) Texas Instruments – SimpleLink Bluetooth low energy Wireless MCU

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CC2640R2F
SWRS204 – DECEMBER 2016
8 Device and Documentation Support
8.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to all pre-production part
numbers or date-code markings. Each device has one of three prefixes/identifications: X, P, or null (no
prefix) (for example, CC2640R2F is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ).
For orderable part numbers of the CC2640R2F device RSM, RHB, RGZ, or YFV package types, see the
Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales
representative.
CC26 xx yyy
PREFIX
X = Experimental device
Blank = Qualified device
zzz (R/T)
DEVICE FAMILY
SimpleLink™ Multistandard
Wireless MCU
DEVICE
40 = Bluetooth
R = Large Reel
T = Small Reel
PACKAGE DESIGNATOR
RGZ = 48-pin VQFN (Very Thin Quad Flatpack No-Lead)
RHB = 32-pin VQFN (Very Thin Quad Flatpack No-Lead)
RSM = 32-pin VQFN (Very Thin Quad Flatpack No-Lead)
YFV = 34-pin DSBGA (Die-Size Ball Grid Array)
ROM version
F128 = ROM version 1
R2F = ROM version 2
Figure 8-1. Device Nomenclature
Copyright © 2016, Texas Instruments Incorporated
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