CC2640R2F Datasheet, PDF (40/64 Pages) Texas Instruments – SimpleLink Bluetooth low energy Wireless MCU

CC2640R2F
SWRS204 – DECEMBER 2016
www.ti.com
The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to
offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the
available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The
µDMA controller has dedicated channels for each supported on-chip module and can be programmed to
automatically perform transfers between peripherals and memory as the peripheral is ready to transfer
more data. Some features of the µDMA controller include the following (this is not an exhaustive list):
• Highly flexible and configurable channel operation of up to 32 channels
• Transfer modes:
– Memory-to-memory
– Memory-to-peripheral
– Peripheral-to-memory
– Peripheral-to-peripheral
• Data sizes of 8, 16, and 32 bits
The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital
supply is off). This circuitry includes the following:
• The RTC can be used to wake the device from any state where it is active. The RTC contains three
compare and one capture registers. With software support, the RTC can be used for clock and
calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be
compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used
instead of a crystal.
• The battery monitor and temperature sensor are accessible by software and give a battery status
indication as well as a coarse temperature measure.
6.11 Voltage Supply Domains
The CC2640R2F device can interface to two or three different voltage domains depending on the package
type. On-chip level converters ensure correct operation as long as the signal voltage on each input/output
pin is set with respect to the corresponding supply pin (VDDS, VDDS2 or VDDS3). Table 6-3 lists the pin-
to-VDDS mapping.
Table 6-3. Pin Function to VDDS Mapping Table
VQFN 7 × 7 (RGZ)
VDDS ⁽¹⁾
DIO 23–30
Reset_N
VDDS2
DIO 0–11
VDDS3
DIO 12–22
JTAG
(1) VDDS_DCDC must be connected to VDDS on the PCB.
Package
VQFN 5 × 5 (RHB)
DIO 7–14
Reset_N
DIO 0–6
JTAG
N/A
VQFN 4 × 4
(RSM)
DIO 5–9
Reset_N
DIO 0–4
JTAG
N/A
DSBGA (YFV)
DIO 7–13
Reset_N
DIO 0–6
JTAG
N/A
6.12 System Architecture
Depending on the product configuration, CC26xx can function either as a Wireless Network Processor
(WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as
a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the
device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second
case, the application must be written according to the application framework supplied with the wireless
protocol stack.
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