BQ24157S Datasheet, PDF (4/45 Pages) Texas Instruments – Full USB Compliance and USB-OTG Support

Not Recommended for New Designs
bq24157S
SLUSB76B – FEBRUARY 2013 – REVISED MAY 2015
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7 Specifications
7.1 Absolute Maximum Ratings^{(1) (2)}
over operating free-air temperature (unless otherwise noted)
Supply voltage (with respect to PGND⁽³⁾)
Input voltage (with respect to PGND⁽³⁾)
VBUS; V_PMID ≥ V_BUS – 0.3 V
SCL, SDA, OTG, SLRST, CSIN, CSOUT, CD
Output voltage (with respect to PGND⁽³⁾)
PMID, STAT
VREF
SW, BOOT
Voltage difference between CSIN and CSOUT inputs (V_(CSIN) – V_(CSOUT))
Voltage difference between BOOT and SW inputs (V_(BOOT) – V_(SW))
Voltage difference between VBUS and PMID inputs (V_(VBUS) – V_(PMID))
Voltage difference between PMID and SW inputs (V_(PMID) – V_(SW))
Output sink
STAT
Output current (average)
SW
T_A Operating free-air temperature range
T_stg Storage temperature range
T_J Junction temperature
MIN
MAX UNIT
–2
20 V
–0.3
7V
–0.3
20 V
-0.3
7V
–0.7
20 V
±7 V
–0.3
7V
–7
0.7 V
–0.7
20 V
10
10 mA
1.55⁽²⁾ A
–30
85 °C
–45
150 °C
–40
125 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Duty cycle for output current should be less than 50% for 10-year lifetime when output current is above 1.5 A.
(3) All voltages are with respect to PGND if not specified. Currents are positive into, negative out of the specified terminal, if not specified.
For thermal limitations and considerations of packages, see Thermal Information .
7.2 ESD Ratings
MIN
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
0
0
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
MAX
2000
500
UNIT
V
7.3 Recommended Operating Conditions
V_BUS
T_J
Supply voltage, bq24157S
Operating junction temperature range
MIN
NOM
4
–40
MAX
6 ⁽¹⁾
125
UNIT
V
°C
(1) The inherent switching noise voltage spikes should not exceed the absolute maximum rating on either the BOOST or SW pins. A tight
layout minimizes switching noise.
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq24157S
YFF (20 PINS)
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
85
25
55
°C/W
4
50
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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