BQ24157S Datasheet, PDF (39/45 Pages) Texas Instruments – Full USB Compliance and USB-OTG Support

Not Recommended for New Designs
www.ti.com
bq24157S
SLUSB76B – FEBRUARY 2013 – REVISED MAY 2015
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
13.1 Package Summary
Chip Scale Package
(Top Side Symbol)
DSBGA Package
(Top View)
A1
A2
A3
A4
TIYMLLLLS
bq24157S
B1
B2
B3
B4
C1
C2
C3
C4
D
D1
D2
D3
D4
E1
E2
E3
E4
E
0-Pin A1 Marker , TI-TI Letters, YM = Year Month Date Code, LLLL = Lot T race Code, S = Assembly Site Code
13.1.1 Chip Scale Packaging Dimensions
The bq24157S device is available in a 20-bump chip scale package (DSBGA, NanoFree™).
The package dimensions are:
D
Max = 2.17 mm
Min = 2.11 mm
E
Max = 2.03 mm
Min = 1.97 mm
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