TLC5948A Datasheet, PDF (2/50 Pages) Texas Instruments – 16-Channel, 16-Bit, ES-PWM, Full Self-Diagnosis LED Driver

TLC5948A
SBVS192 – MARCH 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
TLC5948A
PACKAGE AND ORDERING INFORMATION⁽¹⁾
PACKAGE-LEAD
PACKAGE
DESIGNATOR
ORDERING
NUMBER
SSOP-24, QSOP-24
DBQ
TLC5948ADBQR
TLC5948ADBQ
HTSSOP-24 PowerPAD™
PWP
TLC5948APWPR
TLC5948APWP
TRANSPORT MEDIA,
QUANTITY
Tape and Reel, 2500
Tube, 50
Tape and Reel, 2000
Tube, 60
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Voltage ⁽²⁾
Current
Temperature
Electrostatic discharge (ESD)
ratings:
VCC
SIN, SCLK, LAT, GSCLK, IREF
SOUT
OUT0 to OUT15
OUT0 to OUT15
Operating junction, T_J (max)
Storage, T_stg
Human body model (HBM)
Charged device model (CDM)
VALUE
MIN
MAX
–0.3
+6.0
–0.3
–0.3
–0.3
V_CC + 0.3
V_CC + 0.3
+11
+70
+150
–55
+150
4000
2000
UNIT
V
V
V
V
mA
°C
°C
V
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to device ground terminal.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
TLC5948A
DBQ
(SSOP, QSOP)
PWP
(HTSSOP)
24 PINS
24 PINS
80.4
39.9
44.2
23.2
33.5
21.5
8.8
0.6
33.2
21.3
N/A
3.8
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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