AM1705_16 Datasheet, PDF (157/165 Pages) Texas Instruments – AM1705 ARM® Microprocessor

www.ti.com
AM1705
SPRS657E – FEBRUARY 2010 – REVISED JUNE 2014
X
AM1705
( ) PTP ( ) 3
PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE
SILICON REVISION
B = Silicon Revision 2.0
C = Silicon Revision 2.1
D = Silicon Revision 3.0
DEVICE SPEED RANGE
3 = 375 MHz
4 = 456 MHz
TEMPERATURE RANGE (JUNCTION)
Blank = 0°C to 90°C (Commercial Grade)
D = -40°C to 90°C (Industrial Grade)
A = -40°C to 105°C (Extended Grade)
PACKAGE TYPE
PTP = 176-Pin PowerPAD^TM Plastic Quad Flat Pack
[ PTP Suffix], 0.5mm Pin Pitch
Figure 7-1. Device Nomenclature
7.2 Documentation Support
The following documents describe the device. Copies of these documents are available on the Internet at
www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
Reference Guides
SPRUGU3 AM1705 ARM Microprocessor System Reference Guide
SPRUFU0 AM17x/AM18x ARM Microprocessor Peripherals Overview Reference Guide
7.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
7.4 Trademarks
E2E is a trademark of Texas Instruments.
ARM9 is a trademark of ARM.
ETM9, CoreSight are trademarks of ARM Limited.
All other trademarks are the property of their respective owners.
7.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2010–2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: AM1705
Device and Documentation Support 157