MSP430F2619S-HT Datasheet, PDF (9/90 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430F2619S-HT
www.ti.com
PAD
FUNCTION
1 AVCC
2 DVCC1
3 P6.3/A3
4 P6.4/A4
5 P6.5/A5/DAC1
6 P6.6/A6/DAC0
7 P6.7/A7/DAC1/SVSIN
8
V_REF+
9 XIN
10 XOUT
11 Ve_REF+/DAC0
12 V_REF-/Ve_REF-
13 P1.0/TACLK/CAOUT
14 P1.1/TA0
15 P1.2/TA1
16 P1.3/TA2
17 P1.4/SMCLK
18 P1.5/TA0
19 P1.6/TA1
20 P1.7/TA2
21 P2.0/ACLK/CA2
22 P2.1/TAINCLK/CA3
23 P2.2/CAOUT/TA0/CA4
24 P2.3/CA0/TA1
25 P2.4/CA1/TA2
26 P2.5/Rosc/CA5
27 P2.6/ADC12CLK/DMAE0/CA6
28 P2.7/TA0/CA7
29 P3.0/UCB0STE/UCA0CLK
30 P3.1/UCB0SIMO/UCB0SDA
31 P3.2/UCBOSOMI/UCB0SCL
32 P3.3/UCB0CLK/UCA0STE
33 P3.4/UCA0TXD/UCA0SIMO
34 P3.5/UCA0RXD/UCA0SOMI
35 P3.6/UCA1TXD/UCA1SIMO
36 P3.7/UCA1RXD/UCA1SOMI
37 P4.0/TB0
38 P4.1/TB1
39 P4.2/TB2
40 P4.3/TB3
41 P4.4/TB4
42 P4.5/TB5
43 P4.6/TB6
44 P4.7/TBCLK
45 P5.0/UCB1STE/UCA1CLK
46 P5.1/UCB1SIMO/UCB1SDA
47 P5.2/UCB1SOMI/UCB1SCL
48 P5.3/UCB1CLK/UCA1STE
49 P5.4/MCLK
50 P5.5/SMCLK
Xmin (µm)
90.65
90.65
87.4
87.4
87.4
87.4
87.4
92.95
87.4
87.4
92.95
92.95
87.4
87.4
87.4
87.4
87.4
87.4
87.4
87.4
87.4
559.1
694.7
830.3
1234.9
1370.5
1506.1
1641.7
1777.3
1912.9
2053
2193.1
2328.7
2464.3
2671.1
2807.15
3585.9
3721.5
3861.6
4001.7
4137.3
4887.6
4887.6
4887.6
4887.6
4887.6
4887.6
4887.6
4887.6
4887.6
KGD INFORMATION
BOND PAD CO-ORDINATES
Ymin (µm) Xmax (µm) Ymax (µm)
4729.1
165.65
4804.1
4586.85
165.65
4661.85
4440.3
162.4
4515.3
4282.65
162.4
4357.65
4125.05
162.4
4200.05
3943.9
162.4
4018.9
3762.75
162.4
3837.75
3524.75
167.95
3599.75
3346.6
162.4
3421.6
2472.4
162.4
2547.4
2251
167.95
2326
2082.5
167.95
2157.5
1866.2
162.4
1941.2
1730.6
162.4
1805.6
1595
162.4
1670
1459.4
162.4
1534.4
1323.8
162.4
1398.8
1188.2
162.4
1263.2
1052.6
162.4
1127.6
807.7
162.4
882.7
672.1
162.4
747.1
87.4
634.1
162.4
87.4
769.7
162.4
87.4
905.3
162.4
87.4
1309.9
162.4
87.4
1445.5
162.4
87.4
1581.1
162.4
87.4
1716.7
162.4
87.4
1852.3
162.4
87.4
1987.9
162.4
87.4
2128
162.4
87.4
2268.1
162.4
87.4
2403.7
162.4
87.4
2539.3
162.4
87.4
2746.1
162.4
87.4
2882.15
162.4
87.4
3660.9
162.4
87.4
3796.5
162.4
87.4
3936.6
162.4
87.4
4076.7
162.4
87.4
4212.3
162.4
669.65
4962.6
744.65
805.25
4962.6
880.25
940.85
4962.6
1015.85
1076.45
4962.6
1151.45
1212.05
4962.6
1287.05
1352.15
4962.6
1427.15
1492.25
4962.6
1567.25
1627.85
4962.6
1702.85
2533.55
4962.6
2608.55
SLAS697B – MARCH 2010 – REVISED JUNE 2011
BOND PAD SIZE
X (µm)
Y (µm)
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
BOND PAD CENTER
Xp (µm)
Yp (µm)
128.15
4766.6
128.15
4624.35
124.9
4477.8
124.9
4320.15
124.9
4162.55
124.9
3981.4
124.9
3800.25
130.45
3562.25
124.9
3384.1
124.9
2509.9
130.45
2288.5
130.45
2120
124.9
1903.7
124.9
1768.1
124.9
1632.5
124.9
1496.9
124.9
1361.3
124.9
1225.7
124.9
1090.1
124.9
845.2
124.9
709.6
596.6
124.9
732.2
124.9
867.8
124.9
1272.4
124.9
1408
124.9
1543.6
124.9
1679.2
124.9
1814.8
124.9
1950.4
124.9
2090.5
124.9
2230.6
124.9
2366.2
124.9
2501.8
124.9
2708.6
124.9
2844.65
124.9
3623.4
124.9
3759
124.9
3899.1
124.9
4039.2
124.9
4174.8
124.9
4925.1
707.15
4925.1
842.75
4925.1
978.35
4925.1
1113.95
4925.1
1249.55
4925.1
1389.65
4925.1
1529.75
4925.1
1665.35
4925.1
2571.05
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