TMS320DM6467_09 Datasheet, PDF (6/357 Pages) Texas Instruments – Digital Media System-on-Chip

TMS320DM6467
Digital Media System-on-Chip
SPRS403F – DECEMBER 2007 – REVISED OCTOBER 2009
www.ti.com
Contents
1 Digital Media System-on-Chip (DMSoC) ............ 1
1.1 Features .............................................. 1
1.2 Description............................................ 3
1.3 Functional Block Diagram ............................ 5
2 Revision History ......................................... 7
3 Device Overview ......................................... 9
3.1 Device Characteristics................................ 9
3.2 Device Compatibility................................. 11
3.3 ARM Subsystem .................................... 11
3.4 DSP Subsystem..................................... 15
3.5 Memory Map Summary ............................. 20
3.6 Pin Assignments .................................... 24
3.7 Terminal Functions .................................. 30
3.8 Device Support ...................................... 81
3.9 Documentation Support ............................. 83
4 Device Configurations................................. 84
4.1 System Module Registers ........................... 84
4.2 Power Considerations ............................... 86
4.3 Clock Considerations................................ 89
4.4 Boot Sequence ...................................... 97
4.5 Configurations At Reset............................ 103
4.6 Configurations After Reset......................... 106
4.7 Multiplexed Pin Configurations..................... 114
4.8 Debugging Considerations......................... 137
5 System Interconnect ................................. 139
6 Device Operating Conditions....................... 140
6.1 Absolute Maximum Ratings Over Operating Case
Temperature Range (Unless Otherwise Noted) ... 140
6.2 Recommended Operating Conditions ............. 141
6.3 Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating
Temperature (Unless Otherwise Noted) ........... 142
7 Peripheral Information and Electrical
Specifications ......................................... 144
7.1 Parameter Information ............................. 144
7.2 Recommended Clock and Control Signal Transition
Behavior............................................ 145
7.3 Power Supplies .................................... 146
7.4 External Clock Input From DEV_MXI/DEV_CLKIN
and AUX_MXI/AUX_CLKIN Pins .................. 155
7.5 Clock PLLs......................................... 158
7.6 Enhanced Direct Memory Access (EDMA3)
Controller........................................... 166
7.7 Reset............................................... 186
7.8 Interrupts ........................................... 197
7.9 External Memory Interface (EMIF)................. 203
7.10 DDR2 Memory Controller .......................... 210
7.11 Video Port Interface (VPIF) ........................ 223
7.12 Transport Stream Interface (TSIF)................. 231
7.13 Clock Recovery Generator (CRGEN).............. 241
7.14 Video Data Conversion Engine (VDCE) .......... 244
7.15 Peripheral Component Interconnect (PCI)......... 247
7.16 Ethernet MAC (EMAC)............................. 254
7.17 Management Data Input/Output (MDIO) .......... 264
7.18 Host-Port Interface (HPI) Peripheral ............... 266
7.19 USB 2.0 ............................................ 274
7.20 ATA Controller ..................................... 284
7.21 VLYNQ ............................................. 299
7.22 Multichannel Audio Serial Port (McASP0/1)
Peripherals ......................................... 304
7.23 Serial Peripheral Interface (SPI) ................... 316
7.24 Universal Asynchronouse Receiver/Transmitter
(UART) ............................................. 331
7.25 Inter-Integrated Circuit (I2C) ....................... 338
7.26 Pulse Width Modulator (PWM)..................... 342
7.27 Timers.............................................. 344
7.28 General-Purpose Input/Output (GPIO)............. 347
7.29 IEEE 1149.1 JTAG................................. 350
8 Mechanical Packaging and Orderable
Information ............................................. 353
8.1 Thermal Data for ZUT.............................. 353
8.1.1 Packaging Information............................. 353
6
Contents
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