OMAP3530 Datasheet, PDF (3/230 Pages) Texas Instruments – Applications Processor

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• Package-On-Package (POP) Implementation
for Memory Stacking (CBB Package Only)
• Packages:
– 515-pin PBGA Package (CBB Suffix), .5mm
Ball Pitch (Top), .4mm Ball Pitch (Bottom)
– 423-pin PBGA Package (CUS Suffix), .65mm
OMAP3530/25 Applications Processor
SPRS507 – FEBRUARY 2008
Ball Pitch
• 3.3-V and 1.8-V I/O, 0.8-V to 1.8-V Adaptive
Core Voltage
• Applications:
– TBD
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OMAP3530/25 Applications Processor
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