TMS320C6A8167 Datasheet, PDF (277/280 Pages) Texas Instruments – TMS320C6A816x Integra DSP+ARM Processors

www.ti.com
TMS320C6A8168
TMS320C6A8167
SPRS680 – OCTOBER 2010
10 Mechanical Packaging and Orderable Information
Table 10-1 shows the thermal resistance characteristics for the PBGA–CYG mechanical package.
10.1 Thermal Data for CYG
Table 10-1. Thermal Resistance Characteristics (PBGA Package) [CYG]
NO.
1 RΘ_JC
2 RΘ_JB
Junction-to-case
Junction-to-board
(1) For proper device operation, a heatsink is required.
°C/W ⁽¹⁾
0.21
3.93
10.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2010, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information 277
Submit Documentation Feedback
Product Folder Link(s): TMS320C6A8168 TMS320C6A8167