AM1806 Datasheet, PDF (237/241 Pages) Texas Instruments – AM1806 ARM Microprocessor

AM1806
www.ti.com
SPRS658 – FEBRUARY 2010
8 Mechanical Packaging and Orderable Information
This section describes the device orderable part numbers, packaging options, materials, thermal and
mechanical parameters.
8.1 Device and Development-Support Tool Nomenclature
Figure 8-1 provides a legend for reading the complete device.
X
PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE
SILICON REVISION
B = Silicon Revision 2.0
A. BGA = Ball Grid Array
AM1806
( ) ZWT ( ) 3
DEVICE SPEED RANGE
3 = 375 MHz
4 = 456 MHz
TEMPERATURE RANGE (JUNCTION)
Blank = 0°C to 90°C (Commercial Grade)
D = -40°C to 90°C (Industrial Grade)
A
= -40°C to 105°C (Extended Grade)
PACKAGE TYPE
ZCE = 361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green], 0.65-mm Ball Pitch
ZWT = 361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green]; 0.80-mm Ball Pitch
Figure 8-1. Device Nomenclature
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Mechanical Packaging and Orderable Information 237
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