OMAP-L137_15 Datasheet, PDF (219/222 Pages) Texas Instruments – OMAP-L137 Low-Power Applications Processor

PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2015
PACKAGING INFORMATION
Orderable Device
OMAPL137BZKB3
Status Package Type Package Pins Package
(1)
Drawing
Qty
OBSOLETE BGA
ZKB 256
Eco Plan
(2)
TBD
Lead/Ball Finish
(6)
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MSL Peak Temp
(3)
Call TI
Op Temp (°C)
0 to 90
OMAPL137BZKB4
OBSOLETE BGA
ZKB 256
TBD
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Call TI
0 to 90
OMAPL137BZKBA3
OBSOLETE BGA
ZKB 256
TBD
Call TI
Call TI
-40 to 105
OMAPL137BZKBD4
OBSOLETE BGA
ZKB 256
TBD
Call TI
Call TI
-40 to 90
OMAPL137BZKBT3
OMAPL137DZKB3
OMAPL137DZKB4
OMAPL137DZKBA3
OMAPL137DZKBD4
OMAPL137DZKBT3
XOMAPL137DZKBA3
OBSOLETE
ACTIVE
BGA
BGA
ACTIVE
BGA
ACTIVE
BGA
ACTIVE
BGA
ACTIVE
BGA
ACTIVE
BGA
ZKB 256
TBD
ZKB 256 90 Green (RoHS
& no Sb/Br)
ZKB 256 90 Green (RoHS
& no Sb/Br)
ZKB 256 90 Green (RoHS
& no Sb/Br)
ZKB 256 90 Green (RoHS
& no Sb/Br)
ZKB 256 90 Green (RoHS
& no Sb/Br)
ZKB 256
1
Green (RoHS
& no Sb/Br)
Call TI
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Call TI
Level-3-260C-168 HR
-40 to 125
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
OMAP
L137BZKB3
OMAP
L137BZKB4
OMAP
L137BZKBA3
OMAP
L137BZKBD4
OMAPL137BZKBT3
OMAP
L137DZKB3
OMAP
L137DZKB4
OMAP
L137DZKBA3
OMAP
L137DZKBD4
OMAPL137DZKBT3
XOMAP
L137DZKBA3
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
Samples