STE2002 Datasheet, PDF (49/51 Pages) STMicroelectronics – 81 X 128 SINGLE CHIP LCD CONTROLLER / DRIVER

Table 16. Pad Coordinates (continued)
NAME
PAD
X (µm)
Y(µm)
R11
311
-3571.5
-275.0
R10
312
-3571.5
-325.0
R9
313
-3571.5
-375.0
R8
314
-3571.5
-425.0
R7
315
-3571.5
-475.0
R6
316
-3571.5
-525.0
R5
317
-3571.5
-575.0
R4
318
-3571.5
-625.0
R3
319
-3571.5
-675.0
R2
320
-3571.5
-725.0
R1
321
-3571.5
-775.0
R0
322
-3571.5
-825.0
ICON
323
-3571.5
-875.0
Figure 53. Alignment marks coordinates
X
-3574.5
+3574.5
-2250
+1200
Y
-949.5
-949.5
+949.5
+949.5
MARKS
mark1
mark2
mark3
mark4
STE2002
Figure 54. Alignment marks dimensions
94 µm
39 µm
Table 17. Bumps
Bump
Number
Bumps on Single
Row Size
1-187
212-235
256-260
283-323
Bumps on Two
Rows Size
188-211
236-255
261-282
Pad Size
1-323
Pad Pitch
1-323
Spacing
between Bumps
1-323
Dimensions
30µm X 98 µm X 17.5
30µm X 87 µm X 17.5
43µm X 107µm
50µm
20µm
Table 18. Die Mechanical Dimensions
Die Size
2.07mm x 7.32mm
Wafers Thickness
500µm
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