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SI53360 Datasheet, PDF (5/15 Pages) Silicon Laboratories – 1:8 LOW JITTER CMOS CLOCK BUFFER WITH 2:1 INPUT MUX
Si53360
Table 6. Thermal Conditions
Parameter
Thermal Resistance,
Junction to Ambient
Symbol
JA
Test Condition
Still air
Value
124.4
Unit
°C/W
Table 7. Absolute Maximum Ratings
Parameter
Storage Temperature
Supply Voltage
Input Voltage
Symbol
TS
VDD
VIN
Test Condition
Min
Typ
Max
Unit
–55
—
150
C
–0.5
—
3.8
V
–0.5
—
VDD+
V
0.3
Output Voltage
VOUT
—
—
VDD+
V
0.3
ESD Sensitivity
HBM
HBM, 100 pF, 1.5 kΩ
—
—
2000
V
ESD Sensitivity
CDM
—
—
500
V
Peak Soldering Reflow TPEAK Pb-Free; Solder reflow profile
—
—
260
C
Temperature
per JEDEC J-STD-020
Maximum Junction
TJ
Temperature
—
—
125
C
Note: Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation
specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Rev. 1.1
5