SI53340-45 Datasheet, PDF (23/38 Pages) Silicon Laboratories – Multiple configuration options

Si53340-45 Data Sheet
Pin Descriptions
Pin
Name
Type¹
Description
14
Q2b
O
Output clock 2 (complement).
15
Q3
O
Output clock 3.
16
Q3b
O
Output clock 3 (complement).
GND Pad
Exposed
Ground Pad
GND
Power supply ground and thermal relief. The exposed ground pad is thermally connected
to the die to improve heat transfer from the package. The ground pad must be connected
to GND to ensure device specifications are met.
Note:
1. I = Input; O = Output; P = Power; GND = Ground.
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