SI53340-45 Datasheet, PDF (17/38 Pages) Silicon Laboratories – Multiple configuration options

Si53340-45 Data Sheet
Electrical Specifications
Table 3.6. Additive Jitter, Differential Clock Input
Input^{1, 2}
Output
Additive Jitter (fs rms, 12
kHz to 20 MHz)³
V_DD
Amplitude V_IN Differential 20% to
Freq (MHz) Clock Format (Single-Ended,
80% Slew Rate Clock Format
Typ
Max
Peak-to-Peak)
(V/ns)
3.3
725
Differential
0.15
0.637
LVDS
50
65
3.3
156.25
Differential
0.5
0.458
LVDS
150
200
2.5
725
Differential
0.15
0.637
LVDS
50
65
2.5
156.25
Differential
0.5
0.458
LVDS
145
195
Note:
1. For best additive jitter results, use the fastest slew rate possible. See “AN766: Understanding and Optimizing Clock Buffer’s Addi-
tive Jitter Performance” for more information.
2. AC-coupled differential inputs.
3. Measured differentially using a balun at the phase noise analyzer input. See Figure 1.
Table 3.7. Additive Jitter, Single-Ended Clock Input
Input^{1, 2}
Output
Additive Jitter (fs rms, 12
kHz to 20 MHz)³
V_DD
Amplitude V_IN Single-Ended 20%
Freq (MHz) Clock Format (Single-Ended, to 80% Slew Rate Clock Format
Typ
Max
Peak-to-Peak)
(V/ns)
3.3
156.25
Single-ended
2.18
1
LVDS
150
200
2.5
156.25
Single-ended
2.18
1
LVDS
145
195
Note:
1. For best additive jitter results, use the fastest slew rate possible. See “AN766: Understanding and Optimizing Clock Buffer’s Addi-
tive Jitter Performance” for more information.
2. DC-coupled single-ended inputs.
3. Measured differentially using a balun at the phase noise analyzer input. See figure below.
Table 3.8. Thermal Conditions
Parameter
16-QFN Thermal Resistance, Junction to Ambient
16-QFN Thermal Resistance, Junction to Case
24-QFN Thermal Resistance, Junction to Ambient
24-QFN Thermal Resistance, Junction to Case
32-QFN Thermal Resistance, Junction to Ambient
32-QFN Thermal Resistance, Junction to Case
Symbol
θ_JA
θ_JC
θ_JA
θ_JC
θ_JA
θ_JC
Test Condition
Still air
Still air
Still air
Still air
Still air
Still air
Value
57.6
41.5
37
25
99.6
10.3
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
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