K4T56043QF Datasheet, PDF (4/27 Pages) Samsung semiconductor – 256Mb F-die DDR2 SDRAM

256Mb F-die DDR2 SDRAM
DDR2 SDRAM
2. Package Pinout/Mechnical Dimension & Addressing
2.1 Package Pinout
x4 package pinout (Top View) : 60ball FBGA Package
1
2
3
7
8
9
VDD NC VSS A
NC VSSQ DM _B
VDDQ DQ1 VDDQ C
NC VSSQ DQ3 _D
VDDL VREF _{VSS E}
CKE WE F
NC
BA0 BA1 _G
VSSQ DQS ^VDDQ
DQS VSSQ NC
VDDQ DQ0 VDDQ
DQ2 VSSQ NC
VSSDL CK _VDD
RAS CK ODT
CAS CS
A10
A1 H
A2
A0 VDD
VSS
A3
A5
J
A6
A4
A7
A9 K
A11
A8 VSS
VDD A12
NC
L
NC
NC
Notes:
1. Pin B3 has identical capacitance as pin B7.
2. VDDL and VSSDL are power and ground for the DLL.
Ball Locations (x4)
: Populated Ball
+ : Depopulated Ball
Top View (See the balls through the Package)
123456789
A
+ ++
B
+ ++
C
+ ++
D
+ ++
E
+ ++
F₊
+ ++
G
+ ++
+
H₊
+ ++
J
+ ++
+
K₊
+ ++
L₊
+ ++
+
Page 4 of 27
Rev. 1.5 Feb. 2005