K4T56043QF Datasheet, PDF (14/27 Pages) Samsung semiconductor – 256Mb F-die DDR2 SDRAM

256Mb F-die DDR2 SDRAM
DDR2 SDRAM
Notes:
1. IDD specifications are tested after the device is properly initialized
2. Input slew rate is specified by AC Parametric Test Condition
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, DQS\, RDQS, RDQS\, LDQS, LDQS\, UDQS, and UDQS\. IDD values must be met with all combi-
nations of EMRS bits 10 and 11.
5. Definitions for IDD
LOW is defined as Vin ≤ VILAC(max)
HIGH is defined as Vin ≥ VIHAC(min)
STABLE is defined as inputs stable at a HIGH or LOW level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and control
signals, and
inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including
masks or strobes.
For purposes of IDD testing, the following parameters are utilized
Parameter
CL(IDD)
tRCD(IDD)
tRC(IDD)
tRRD(IDD)-x4/x8
tRRD(IDD)-x16
tCK(IDD)
tRASmin(IDD)
tRP(IDD)
tRFC(IDD)
DDR2-667
5-5-5
5
15
60
7.5
10
3
45
15
105
DDR2-533
4-4-4
4
15
60
7.5
10
3.75
45
15
105
DDR2-400
3-3-3
3
15
55
7.5
10
5
40
15
105
Units
tCK
ns
ns
ns
ns
ns
ns
ns
ns
Detailed IDD7
The detailed timings are shown below for IDD7.
Legend: A = Active; RA = Read with Autoprecharge; D = Deselect
IDD7: Operating Current: All Bank Interleave Read operation
All banks are being interleaved at minimum ^tRC(IDD) without violating ^tRRD(IDD) using a burst length of 4. Control and address bus
inputs are STABLE during DESELECTs. IOUT = 0mA
Timing Patterns for 4 bank devices x4/ x8/ x16
-DDR2-400 3/3/3
A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D
-DDR2-533 4/4/4
A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D
-DDR2-667 5/5/5
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D
Page 14 of 27
Rev. 1.5 Feb. 2005