K4T51043QG Datasheet, PDF (4/47 Pages) Samsung semiconductor – 512Mb G-die DDR2 SDRAM Specification

K4T51043QG
K4T51083QG
K4T51163QG
DDR2 SDRAM
1.0 Ordering Information
Org.
DDR2-800 5-5-5
DDR2-800 6-6-6
DDR2-667 5-5-5
DDR2-533 4-4-4
DDR2-400 3-3-3
Package
128Mx4 K4T51043QG-HC(L)E7 K4T51043QG-HC(L)F7 K4T51043QG-HC(L)E6 K4T51043QG-HC(L)D5 K4T51043QG-HC(L)CC 60 FBGA
64Mx8 K4T51083QG-HC(L)E7 K4T51083QG-HC(L)F7 K4T51083QG-HC(L)E6 K4T51083QG-HC(L)D5 K4T51083QG-HC(L)CC 60 FBGA
32Mx16 K4T51163QG-HC(L)E7 K4T51163QG-HC(L)F7 K4T51163QG-HC(L)E6 K4T51163QG-HC(L)D5 K4T51163QG-HC(L)CC 84 FBGA
Note :
1. Speed bin is in order of CL-tRCD-tRP
2. “H” of Part number(12th digit) stands for Lead-Free, Halogen-Free, and RoHS compliant products.
2.0 Key Features
Speed
CAS Latency
tRCD(min)
tRP(min)
tRC(min)
DDR2-800 5-5-5
5
12.5
12.5
57.5
DDR2-800 6-6-6
6
15
15
60
DDR2-667 5-5-5
5
15
15
60
DDR2-533 4-4-4
4
15
15
60
DDR2-400 3-3-3
3
15
15
55
Units
tCK
ns
ns
ns
• JEDEC standard V_DD = 1.8V ± 0.1V Power Supply
• V_DDQ = 1.8V ± 0.1V
• 200 MHz f_CK for 400Mb/sec/pin, 267MHz f_CK for 533Mb/sec/
pin, 333MHz f_CK for 667Mb/sec/pin, 400MHz f_CK for 800Mb/
sec/pin
• 4 Banks
• Posted CAS
• Programmable CAS Latency: 3, 4, 5, 6
• Programmable Additive Latency: 0, 1 , 2 , 3, 4 , 5
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/Nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Single-ended data-
strobe is an optional feature)
• Off-Chip Driver(OCD) Impedance Adjustment
• On Die Termination
• Special Function Support
-50ohm ODT
-High Temperature Self-Refresh rate enable
• Average Refresh Period 7.8us at lower than T_CASE 85°C,
3.9us at 85°C < T_CASE < 95 °C
• All of products are Lead-Free, Halogen-Free, and RoHS com-
pliant
The 512Mb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x
4banks or 16Mbit x 8 I/Os x 4banks or 8Mbit x 16 I/Os x 4 banks
device. This synchronous device achieves high speed double-
data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for
general applications.
The chip is designed to comply with the following key DDR2
SDRAM features such as posted CAS with additive latency, write
latency = read latency -1, Off-Chip Driver(OCD) impedance
adjustment and On Die Termination.
All of the control and address inputs are synchronized with a pair
of externally supplied differential clocks. Inputs are latched at the
crosspoint of differential clocks (CK rising and CK falling). All I/Os
are synchronized with a pair of bidirectional strobes (DQS and
DQS) in a source synchronous fashion. The address bus is used
to convey row, column, and bank address information in a RAS/
CAS multiplexing style. For example, 512Mb(x8) device receive
14/10/2 addressing.
The 512Mb DDR2 device operates with a single 1.8V ± 0.1V
power supply and 1.8V ± 0.1V V_DDQ.
The 512Mb DDR2 device is available in 60ball FBGAs(x8) and in
84ball FBGAs(x16).
Note : The functionality described and the timing specifications included in
this data sheet are for the DLL Enabled mode of operation.
Note : This data sheet is an abstract of full DDR2 specification and does not cover the common features which are described in “Samsung’s DDR2
SDRAM Device Operation & Timing Diagram”
4 of 47
Rev. 1.4 December 2008