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K4H281638L Datasheet, PDF (27/32 Pages) Samsung semiconductor – 128Mb L-die DDR SDRAM Specification
K4H281638L
DDR SDRAM
24.0 IBIS : I/V Characteristics for Input and Output Buffers
DDR SDRAM Output Driver V-I Characteristics
DDR SDRAM Output driver characteristics are defined for full and half strength operation as selected by the EMRS bit A1.
Figures 4, 5 and 6 show the driver characteristics graphically, and tables 8, 9 and 10 show the same data in tabular format suitable for
input into simulation tools. The driver characteristcs evaluation conditions are:
Typical
Minimum
Maximum
25×C
70×C
0×C
VDD/VDDQ = 2.5V, typical process
VDD/VDDQ = 2.3V, slow-slow process
VDD/VDDQ = 2.7V, fast-fast process
Output Driver Characteristic Curves Notes:
1. The full variation in driver current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines
the of the V-I curve of Figures 4, 5 and 6.
2. It is recommended that the "typical" IBIS V-I curve lie within the inner bounding lines of the V-I curves of Figures 4, 5 and 6.
3. The full variation in the ratio of the "typical" IBIS pullup to "typical" IBIS pulldown current should be unity +/- 10%, for device drain to
source voltages from 0.1 to1.0. This specification is a design objective only. It is not guaranteed.
160
140
Maximum
120
Typical High
100
80
Typical Low
60
Minimum
40
20
0
0.0
0.5
1.0
1.5
2.0
2.5
Pull-down Characteristics for Full Strength Output Driver Vout(V)
0.0
1.0
2.0
0
-20
-40
Minumum
-60
Typical Low
-80
-100
-120
-140
-160
Typical High
-180
-200
Maximum
-220
Pull-up Characteristics for Full Strength Output Driver
Vout(V)
Figure 4. I/V characteristics for input/output buffers:Pulldown(above) and pullup(below)
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Rev. 1.2 Feburary 2009